CONVECTION REFLOW OVEN
BTU’s Pyramax™ family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly.
Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. With 6, 8, 10 and 12-zone air or nitrogen models, 350oC maximum temperature and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value. For high-volume, high-mix manufacturers the Pyramax is now available as a dual chamber reflow oven – the ZeroTurn. The ZeroTurn eliminates recipe changeover time by allowing two different thermal profiles to be ready simultaneously.
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VACUUM REFLOW OVEN FOR HIGH-VOLUME MANUFACTURING
The Pyramax Vacuum reflow oven has been designed with the requirements of large EMS/high-volume automotive customers in mind. The unit is configured with 10 zones of closed-loop convection heating and a maximum production width of 457 x 457mm (18 x 18 inches) inches under vacuum operation. Nitrogen atmosphere capable, the Pyramax Vacuum reflow oven offers a maximum process temperature of 350° C. The unit features integrated controls with BTU’s proprietary Wincon™ windows-based control system and full integration with factory MES/Industry 4.0, including vacuum parameters. Existing Pyramax customers can easily transfer their process to the new Pyramax Vacuum reflow oven.
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ELIMINATE REFLOW OVEN CHANGEOVER TIME
Get more out of your SMT line with Pyramax ZeroTurn. Our dual chamber reflow oven eliminates process changeover time while preserving the process control that the Pyramax family of reflow ovens is known for. Zero turnaround means that high volume manufacturers, Pyramax Dual Chamber Reflow Oventhat have to contend with product mix, deal with less downtime – enabling higher productivity from the whole line.Our dual chamber reflow oven design truly isolates the two processes, with independent temperature, belt speed and static pressure convection rate controls. Lead-free and leaded processes can be at temperature, side-by-side, without affecting cross board thermal uniformity in either chamber.
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NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS
Built on the industry-leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrBottom chamber of a Pyramax TrueFlat convection reflow oven.ate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the Pyramax’s closed-loop convection heating. The new Pyramax with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.
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